Toshiba Launches Package-on-Package Memory Components for Cellular Handsets (SYS-CON Media)
Toshiba America Electronic Components, Inc. (TAEC) today announced availability of high-capacity memory solutions using Package-on-Package (PoP) technology, a multi-chip packaging technique that enables significant circuit board space savings in cellular handsets by stacking a high-density memory component on top of the processor so the two components require only one footprint on the board.
Distributed Drive Eliminates Components and Lowers Cost of Motion System (PRWeb via Yahoo! News)
Distributed architecture of the ION Digital Drive from PMD simplifies design, eliminates components, and lowers cost for DC brush, brushless DC and microstepping control.
RFMD Introduces Components for 3G Multimode Handsets (Cellular-News.com)
RF Micro Devices has introduced a portfolio of complementary cellular components designed to address the increasing complexity of cellular front-ends in multimode 3G handsets.
Jaco Turns Fiscal 2Q Profit (AP via Yahoo! Finance)
Electronic components distributor Jaco Electronics Inc. said Friday it swung to a fiscal 2007 second-quarter profit on higher sales.
Hearing Components Introduces the Comply(TM) Whoomp! (TM) Earbud Enhancer (SYS-CON Media)
Hearing Components launches Whoomp! (TM) Earbud Enhancers, designed to fit all iPod earbuds. (One size fits all)
Thomas & Betts Gets Upgrade From S&P (AP via Yahoo! Finance)
Standard & Poor`s Ratings Services on Friday raised its ratings on Thomas & Betts Corp., which makes electrical components, citing its improved operating performance.
Raytheon Gets $20M Contract Boost (AP via Yahoo! Finance)
The U.S. Missile Defense Agency said Friday it awarded a $20 million contract boost to Raytheon Co. Raytheon will manufacture, deliver and integrate radar components on a defense system.
Microsoft: Vista follow-up likely in 2009 (InfoWorld via Yahoo! News)
With Vista just out the door, Microsoft is now drawing up plans to deliver its follow-up client operating system by the end of 2009, according to the executive in charge of building the product`s core components.
PC and Components (ARNnet)
Synnex has signed on to distribute AMD kit in Australia, New Zealand and Taiwan. Synnex managing director, Kee Ong, said the regional CPU deal would enhance its overall components line-up.
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